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Probabilistic Fatigue Life Analysis of High Density Electronics Packaging

by N. R. Moore,
E. A. Kolawa,
S. Sutharshana,
L. E. Newlin,
M. Creager,



Document Type: Proceeding Paper

Part of: Probabilistic Mechanics & Structural Reliability

Subject Headings: Material properties | Thermal loads | Probability | Finite element method | Fatigue life | Electronic equipment | Cracking

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