Probabilistic Fatigue Life Analysis of High Density Electronics Packaging
by N. R. Moore,E. A. Kolawa,
S. Sutharshana,
L. E. Newlin,
M. Creager,
Document Type: Proceeding Paper
Part of: Probabilistic Mechanics & Structural Reliability
Subject Headings: Material properties | Thermal loads | Probability | Finite element method | Fatigue life | Electronic equipment | Cracking
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