Probabilistic Fatigue Life Analysis of High Density Electronics Packaging

by N. R. Moore,
E. A. Kolawa,
S. Sutharshana,
L. E. Newlin,
M. Creager,

Document Type: Proceeding Paper

Part of: Probabilistic Mechanics & Structural Reliability

Subject Headings: Probability | Fatigue life | Material properties | Finite element method | Thermal loads | Cracking | Electronic equipment

Services: Buy this book/Buy this article


Return to search