Thermal Stresses in Piezoelectric Materials: A Boundary Integral Formulation

by J. S. Lee, Clarkson Univ, Potsdam, NY, USA,
L. Z. Jiang, Clarkson Univ, Potsdam, NY, USA,



Document Type: Proceeding Paper

Part of: Engineering, Construction, and Operations in Space IV

Abstract:

With the increasing use of piezoelectric materials in electromechanical devices which are often required to function in thermally hostile environment, thermal stresses and their influence on the performance of piezoelectric sensors and actuators are of great interest. Based on the linear theory of piezothermoelasticity, a numerical formulation for the thermal-stress analysis in piezoelectric materials is proposed in this paper. The `displacement-potential' boundary integral formulation proposed recently by the authors is extended by coupling heat conduction to the quasi-static piezoelasticity. A fundamental solution is obtained in closed form for a two-dimensional transversely isotropic material and is then numerically implemented in conjunction with the spline boundary element method. Several test problems are considered to validate our method proposed and the preliminary results are shown to be satisfactory.



Subject Headings: Thermal loads | Piezoelectricity | Domain boundary | Integrals | Thermal analysis | Thermal effects | Linear analysis | Boundary element method

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