Microcrack Interaction Toughening in Ceramics and CMCs

by Vistasp M. Karbhari, Univ of Delaware, Newark, United States,

Document Type: Proceeding Paper

Part of: Engineering Mechanics


The generation of microcracks, which causes an extension of the damage zone at values of stress intensity factor, K, below the expected critical level represented by KIC has been recognized as an important strength limiting mechanism in a number of advanced materials. The understanding of the effects - toughening and shielding - of microcrack array interaction with the main crack is viewed to be critical for the design of ceramics and brittle matrix composites. The paper discusses the analysis of possible effects - toughening and shielding due to process zone microcracking using the double layer potential theory. The analysis is extended to analyze effects of process zone microcracking in ceramic matrix composites.

Subject Headings: Cracking | Ceramics | Strength of materials | Composite materials | Materials processing | Stress analysis | Brittleness | Matrix (mathematics)

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